HP Z600 User Manual

6. Disconnect the CPU heatsink fan cable from the system board as shown in the following figure.
Figure 5-83 Disconnecting the heatsink fan cable
7. Before lifting the heatsink, gently twist the heatsink to break the thermal compound between the
CPU and the heatsink.
8. Lift the CPU heatsink out of the chassis
2
.
9. Use alcohol and a soft cloth to clean the thermal interface residue from the CPU and the heatsink,
allowing the alcohol on the CPU and CPU heatsink to dry completely.
Installing the CPU heatsink
1. Perform one of the following tasks:
●
If you are reusing the original heatsink, apply thermal compound to the center of the CPU top
surface.
●
If you are using a new CPU heatsink, do not apply thermal compound to the CPU because
the new heatsink already has thermal compound applied to the heatsink surface. Instead,
remove the thermal compound protective liner from the bottom of the new heatsink.
2. Align the four mounting screws with the mounting holes in the system board and carefully place
the heatsink on the CPU.
Ensure that the heatsink is placed properly with the fans positioned toward the front.
CAUTION: Do not overtighten the heatsink screws. If you overtighten them, you might strip the
threads in the system board tray.
Do not fully tighten one screw and then move on to the next. Instead, tighten all screws a little at
a time, ensuring that the CPU remains level.
3. Tighten all screws partially so the CPU heatsink remains level.
140 Chapter 5 Replacing components ENWW

HP Z600 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor cache	4 MB
Processor cores	4
Processor model	E5504
System bus rate	4.8 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Number of QPI links	2
Processor frequency	2 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor front side bus	- MHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	15
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	800 MHz
Memory bandwidth supported by processor (max)	19.2 GB/s
Maximum internal memory supported by processor	144 GB
Audio system	Integrated High Definition Realtek ALC262 Audio, optional Creative X-Fi Titanium PCIe Audio Card, optional HP Thin USB Powered Speakers
Product type	Workstation
Motherboard chipset	Intel® 5520
Internal memory	1 GB
Memory channels	Triple-channel
Memory clock speed	1333 MHz
Maximum internal memory	24 GB
Memory layout (slots x size)	1 x 1 GB
HDD speed	7200 RPM
HDD capacity	250 GB
HDD interface	SATA
Optical drive type	DVD Super Multi
I/O ports	Front: 3 USB 2.0, 1 microphone in, 1 headphone out, optional 1 IEEE 1394a; Rear: 6 USB 2.0, 1 audio in, 1 audio out, 1 microphone in, 2 PS/2, 1 RJ-45 to integrated Gigabit LAN, optional 1 serial; Internal: 3 USB 2.0
Serial ports quantity	0
USB 2.0 ports quantity	9
Power supply	650 W
Display	HP LP1965 19-inch LCD Monitor, HP LP2065 20-inch LCD Monitor, HP LP2275w 22-inch Widescreen LCD Monitor, HP LP2475w 24-inch Widescreen LCD Monitor, HP DreamColor LP2480zx Professional Display (24-inch widescreen), HP LP3065 30-inch Widescreen LCD Monitor (all sold separately)
Drive bays	2 external 5.25\
Graphics card	-
Keyboard type	HP PS/2 Standard Keyboard
Expansion slots	2 PCI Express Gen2 x16, 1 PCI Express Gen2 (x8 mechanically, x4 electrically), 1 PCI Express Gen1 (x8 mechanically, x4 electrically), 2 PCI
Pointing device	HP USB Laser Scroll Mouse
Power requirements	650 watts wide-ranging, active Power Factor Correction, 85% efficient Power Supply
Storage drive type	250 GB 7200 rpm SATA NCQ SATA 250 GB
HDD controller type	SATA (10000 rpm) SATA (7200 rpm) SAS (15000 rpm)
Video card features	No integrated Graphic Card
Maximum HDD capacity	600 GB
Storage drive controller	Integrated 6 channel SATA 3 Gb/s controller with RAID (0, 1, 5 or 10) capability, optional SAS controller, LSI 3041E 4-port SAS/SATA, with RAID (0, 1 or 10) capability
Minimum storage drive space	146 GB
Non-operating altitude	9100 m
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	8 - 90 %
Operating relative humidity (H-H)	8 - 85 %
Operating system installed	Windows Vista Business
Compatible operating systems	Red Hat Enterprise Linux WS 5 64-bit, Novell Suse SLED 11
Maximum graphics card memory	0.032 GB
Chassis type	Mini Tower
Country of origin	China
Processor code	SLBF9
Processor ARK ID	40711
Processor package size	42.5 x 45 mm

Weight and Dimensions

Depth	440 mm
Width	165.3 mm
Height	445.1 mm
Weight	19000 g