OPERATION OF THE MACHINE
MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06
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20
1.3 Operating Procedures
A condensed step by step operation instruction is de-
scribed in chapter 3.5 Step by step machine interac-
tions.
1.3.1 Power on Procedure
A. Before powering on the machine check or ad-
just
– Compressed Air: 5 bar
– Nitrogen: 1 bar
– Vacuum. The gauge should read -0.8 bar
Turn the MAIN POWER switch (on left side of align-
ment stage) to the ON position.
B. Ignition of the exposure lamp (CIC 1200)
POWER SWITCH ELECTRONIC of the machine
should be OFF. Switch on power of the Constant In
-
tensity Controller (CIC). The software version is
shown in the display. The CIC performs a self calibra
-
tion test and displays "ready". Press CP (constant
power) key. Display shows "wait", followed by "Start".
Press START key. This will ignite the exposure lamp.
LED LAMP LIFE/POWER is flashing until lamp warm
-
ing up is finished. For more detailed information use
the CIC-manual.
Attention! Nitrogen failure for longer
then 5 minutes will turn off the
exposure lamp!
C. Starting the machine
Shortly turn the POWER SWITCH ELECTRONIC
(201) on the frontpanel clockwise into ON position
and release. Machine initialize. An example for the
display message is:
"Ready for Start - press LOAD Button
MA6-BA6-[M] V 4.000 04.05.01 SW:P"
The meaning of the second displayed line is:
configuration software version date includ-
ed options (here: purge)
Press the flashing LOAD key on the keyboard.
"Watch out machine is starting!"
Now you are asked for:
"Select machine configuration: MA6"
Select between mask align- (MA6) and bond align-
(BA6) operation mode (with the Y-ARROW keys). Af
-
ter this selection the software is loaded and the ma-
chine is in a initial state, ready for operate and
displays:
"Ready for load"
All motorized manipulators (TSA, BSA and alignment
stage) are set to the position used before the ma
-
chine was powered off. For your information: if you
need a software reset, press the key combination
FAST - UNLOAD (nearly 200ms time distance). Keep
the EDIT PARAMETER key (311) pressed down while
power on the POWER SWITCH ELECTRONIC (201)
overwrites all parameter settings with the default val
-
ues from the EPROM. Power off the machine by turn-
ing the POWER SWITCH ELECTRONIC (201) on the
front panel counterclockwise into OFF position and
release.
1.3.2 First Mask Print Mode
The first mask print of a wafer is done without align-
ment. This software sequence is started by the EX-
POSURE key. Starting from the initial state of the
machine this steps has to be performed:
1. Adjust Parameters
– select mask loading type: F1 key
Make secure that no mask is loaded before select
mask loading type.
– select exposure mode: SELECT PROGRAM key
Press SELECT PROGRAM key (310). Toggle
through the menu and confirm your exposure pro
-
gram by pressing SELECT PROGRAM key again.
– edit parameters: EDIT PARAMETER key
Press EDIT PARAMETER key (311) to edit the pa-
rameter. Change all necessary value and confirm
by pressing EDIT PARAMETER key again.
– save all settings: EDIT PROGRAM key
This function is an optional possibility to save this
parameter set for the future. Toggle with the X-
ARROW keys to "SAVE Pgm.". Select with the Y-
ARROW keys a program number. Prior saved
programs to the same number will be overwritten
without warning. Save the settings by the EDIT
PROGRAM key (312). Existing programs can be
loaded from here.
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