Operation of the Machine
MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06
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1. OPERATION OF THE MACHINE
The SUSS MA6 Mask Aligner is designed for high
resolution photolithography in a laboratory for devel
-
opment, small volume production or pilot production
environment.
It offers unsurpassed flexibility in the handling of irreg-
ularly shaped substrates of varying thickness, as well
as standard size wafers up to 150 mm in diameter
and substrates up to 6"x 6".
Wafers and substrates up to 6 mm thickness may be
processed.
With the modular concept, the MA6 enable easy ser-
vice. The functional groups are easily accessible and
the subassemblies can be quickly exchanged.
The SUSS MA6 represents a new generation of state
of the art mask aligners, combining time proven fea
-
tures with newly developed technology for mask
aligning wafers, substrates and fractions of it. Based
on the proven world wide leader in it's lithography ap
-
plication for more then three decades the SUSS
MJB3.
With the SUSS MA6, all contact exposure programs
are supplied (vacuum, hard, soft contact and proxim
-
ity). X- and Y-shift are below 0.1 µm and not detect-
able by optical means.
The 400 nm exposure wavelength version is capable
of 0.6 µm resolution in vacuum contact. Using 300
nm or 250 nm exposure optics or an excimer laser
improves resolution to 0.2 µm.
Various alignment options are available. Top side
alignment with a splitfield or a video microscope.
Back side alignment with BSA scopes as well as sev
-
eral infrared alignment solutions.
SUSS Mask Aligner MA6
1 EMERGENCY POWER OFF
2 TSA microscope
3 Upper panel control
4 Alignment stage
5 Keyboard
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