SUSS MA6 - 3.2 List of Abbreviations

Appendix
MA6 / MA8 - 3 Appendix - Rev.05 07-06
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3
3.2 List of Abbreviations
Θ Theta rotation
Al. Gap Alignment gap
AL400 Large gap alignment system
BA Bond aligner
BSA Bottom side alignment
BsSubPx WEC with spacers beside substrate
CIC Constant intensity controller
Cont Contact
DIP Mikro switch at microcontroller card
DVCU Digital video control unit
E Error message
Exp. Exposure
Exp. T. Exposure time
Flood-E Exposure type: flood exposure(without mask)
F-WEC Force-sensor WEC
GlobCont Global WEC, contact mode
GlobSpac Global WEC, spacer mode
GWEC Global wedge error compensation
Hard Exposure type: hard contact
Hard Ct Exposure type: hard contact
HC Wait T. Hard contact wait time
IR InfraRed
ISA Inter substrate alignment
L:F Load the substrate by fixture
L:S Load the substrate by slide
LED Light emitting diode
Low Vac Exposure type: low vacuum contact
Lvac-Ct Exposure type: low vacuum contact
M.Pin Middle pin
MA Mask aligner
Mholder Mask holder