OPERATION OF THE MACHINE
MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06
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3. Load Wafer Chuck for BSA
– Insert a proper chuck without wafer onto the
transport slide
Move the BSA-chuck placed onto the transport
slide into the machine. Don't press a key.
4. Microscope Alignment
– set the monitor image: SPLITFIELD switch
Turn the SPLITFIELD switch (214) to middle posi-
tion and toggle BSA MICROSCOPE key on (LED
on). This key enables the microscope manipula
-
tors accordingly.
– microscope illumination: ILLUMINATION to BSA/
IR
Turn the ILLUMINATION switch (210) to BSA/IR
and adjust the light intensity by the potentiome
-
ters labeled BSA/IR microscope illumination left/
right (211).
– focus on the top focus plane: TOP/BOTTOM key
Make secure the TOP/BOTTOM key LED (326) is
on and adjust the fine focus separately with the
TOP SUBSTRATE LEFT/RIGHT regulators.
– move objectives to the chuck opening: LEFT,
BOTH, RIGHT keys
Select one of these keys to move the left/right ob-
jective with the ARROW keys. If necessary use
fast speed (FAST key LED on).
– grab image: GRAB IMAGE key (option)
First keystroke grabs the mask image. The objec-
tives move to the wafer focus plane (TOP/BOT-
TOM key LED off). The motor control of the
microscope manipulator is disabled. Second key
-
stroke GRAB IMAGE key deletes stored image
and enables the manipulator again.
5. Load Wafer
– pull out transport slide and load wafer: LOAD key
After grab image the machine informs you: "ready
for load... BSA image stored". Press LOAD key to
start this procedure. Load wafer onto chuck and
push slide into the machine as prompted on the
display. Press ENTER key.
Attention! Microscope moves
downwards!
– wedge error compensation
WEC starts automatically. After WEC the wafer
will move to the alignment gap.
6. Wafer Alignment
– focus on the wafer plane
Adjust the left/right objective image with the BOT-
TOM SUBSTRATE LEFT/RIGHT (216) regulators.
Correct illumination if necessary.
– alignment
Use the micrometer screws of the alignment
stage for STG-X-Y-Θ-MOVEMENT (103, 104,
105). If these doesn't exist use instead this the
ARROW-keys or joysticks. Align the wafer align
-
ment marks central symmetrical to the mask
alignment marks (see Figure 7 alignment proce
-
dure).
If mask and wafer are in contact
(CONTACT INDICATOR on),
don't align the wafer!
– alignment check
Depending on your requirements, an alignment
check could be helpful using the SEP keys (303),
ALIGN CONT/EXP key (304) or the ALIGNMENT
CHECK key (305).
7. Exposure
– EXPOSURE key
By pressing this key the wafer will move into ex-
posure position. Exposure takes place. Despite
the exposure was initiated hitting the UNLOAD
key before the light shutter has opened will con
-
tinue it's exposure without wafer exposure. After
finishing the wafer chuck moves down for unload
the exposed wafer.
8. Unload mask: CHANGE MASK key
– CHANGE MASK key
Hit the CHANGE MASK key and the mask holder
will be released. Slide the mask holder out, flip it
by 180° and store it on the tray to your left. Hit EN
-
TER to switch the mask vacuum off. Retract the
mechanical clamping and remove the mask.
1.3.5 Single Bottom Side Alignment
This procedure describes the adjustment of small
substrates to a mask using only one BSA micro
-
scope. Therefor we recommend a transparent wafer
chuck. Starting from the initial state of the machine
these steps have to be performed:
1. Adjust Parameters
– select maskloading type: F1 key
Make secure that no mask is loaded before select
mask loading type. Select mask loading by slide
with BSA alignment.
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