SUSS MA6 - 3 Appendix; 3.1 Parameter Ranges and Default Settings

Appendix
MA6 / MA8 - 3 Appendix - Rev.05 07-06
53
3
3 APPENDIX
3.1 Parameter Ranges and Default Settings
The table shows the range of values for parameters included in the main processes exposure and bonding.
Parameter Description Default value Range of Values
Expose Type Type of exposure Soft [Soft, Hard, Low Vac,
Vac, Prox, Flood-E]
Exp. Time Time of exposure 5.0 sec. [0.1...999.9]
Wait Time Pause between the expose
cycles, using Multiple Expo
-
sure
10 sec. [1...999,9]
Exp. Cycles No. of cycles, using Multiple
Exposure
3 [1...500]
Al. Gap Alignment distance during
the alignment
100 µm [10...300]
Exp. Gap Distance during the expos-
ure in proximity
50 µm [0...300]
HC-Wait Time Time for N
2
purge under the
wafer prior exposure
4 sec. [0...30]
Pre Vac Time of the pre-vacuum with
reduced vacuum pressure
4 sec. [0...30]
Full Vac Time with full vacuum before
exposing in vacuum contact
4 sec. [0...30]
Vac Purge N
2
purge time into the
vacuum chamber after
exposure
4 sec. [0...30]
N
2
Purge Time
1
N
2
purge time before expos-
ure for exposing in N
2
atmosphere
4 sec. [0...999]
N
2
Purge Gap
1
Gap distance during N
2
Purge for exposing in N
2
atmosphere
30 µm [0...1000]
WEC-Offset Substrate position optional
different to contact- respec
-
tively to 0-position
0 µm [+/- 50]
WEC Type Type of the Wedge Error
Compensation
Cont [Cont / Spacer /
GlobCont
2
/
GlobSpac
2
]
WEC delay Time to get parallelism bet-
ween substrate and mask
1 sec. [0,1...120]
Spacer Thick Thickness of the spacers MA = 2000
BA = 100 µm
[50, 100, 125, 200,
1000, 2000]
Substrate Thick Thickness of substrate using
global WEC
500 µm [10...3000]