Appendix
MA6 / MA8 - 3 Appendix - Rev.05 07-06
85
3
3.7.2 Overview for Valves, Throttles, Sensors, etc.
Valves (V)
# Medium Function
V 1.1 N
2
Nitrogen under wafer (Hardcontact + Vac. Contact)
V 1.2 N
2
Nitrogen under wafer (Release after exposure )
V 1.3 V Wafer vacuum (Chuck)
V 1.4 N
2
Vacuum reduction (Chuck)
V 1.5 N
2
Nitrogen purge to break vacuum inside chamber after exposure
V 1.6 N
2
Nitrogen pressure regulates vacuum level inside chamber
V 1.7 V Prevacuum vacuum chamber
V 1.8 V Main vacuum vacuum chamber
V 1.9 N
2
Inflatable rubber seal ( vacuum seal )
V 1.10 V Vacuum clamp chuck to WEC-head
V 1.11 P WEC-break
V 1.12 V Chuck waferload pins down (BA only)
V 1.13 P Chuck waferload pins up (BA only)
V 1.14 V Transport slide wafer vacuum
V 1.15 P Transport slide clamping
V 1.16 P Proximity rotary actuator open ( BA only )
V 1.17 P Maskholder clamping / Proximity rotary actuator close (BA only)
V 1.18 P Substrate clamping rotary act. Open (BA only)
V 1.19 P Substrate clamping rotary act. Close (BA only)
V 1.20 P Bond fixture clamping (BA only)
V 1.21 V Bond fixture wafer vacuum (BA only)
V 1.22 N
2
Nitrogen purge to break wafer vacuum (BA only)
V 1.23 P Proximity flags Maskholder
V 1.24 V Mask vacuum
V 1.25 P Bondadapter z-motion up (BA only)
V 1.26 P Bondadapter z-motion down (BA only)
V 1.27 P Chuck supporting moveable fingers (for ISA only)
V 1.28 A+B N
2
Chamber purge negative resist
V 1.29 N
2
Purge Maskholder
V 1.30 N
2
N
2
-Lance Purge, substrate separation
V 1.31 V Vacuum maskblank
V 1.32 V Vacuum chamber for chamber purge negative resist
V 8.1 P TSA-microscope up