SUSS MA6 - Throttles (T; TO)

Appendix
MA6 / MA8 - 3 Appendix - Rev.05 07-06
3
86
Throttles (T / TO)
V 8.2 P TSA-microscope down
V 8.3 P TSA-microscope clamping
V 9.1 P Exposure shutter opener
V 9.2 P Exposure shutter closer
V 9.3 P Exposure unit clamping
V 9.4 P Mirror house forward
V 9.5 P Mirror house backward
# Function
T 1.1 Nitrogen pressure for hardcontact
T 1.1.1 Nitrogen flow for hardcontact
T 1.2 Nitrogen purge to break vacuum under the wafer
T 1.4 Nitrogen flow to control vacuumlevel under the wafer
T 1.5 Nitrogen pressure to purge vacuum chamber
T 1.5.1 Nitrogen bleed to atmosphere when vac. Chamber is released
T 1.6 Nitrogen flow to control vacuum level inside vacuum chamber
TO 1.7 Determines vacuum flow for prevacuum when vac. Contact
T 1.11 Determines speed to release WEC breaks
TO 1.11.1 Determines speed to build up adjustable WEC pressure
T 1.13 Controls speed of waferload pins
TO 1.15 Controls speed of transport slide clamp
TO 1.16 Controls proximity rotary actuator close
TO 1.17 Controls proximity rotary actuator open/ maskholderclamping
TO 1.18 Controls speed of substrate clamping rotary actuator close
TO 1.19 Controls speed of substrate clamping rotary actuator open
T 1.20 Controls speed of bond fixture clamping
T 1.22 Nitrogen flow to release wafer of the bond fixture vacuum
T 1.23 Controls speed of prox. Flags motion out
TO 1.23 Controls speed of prox. Flags motion in
TO 1.25 Controls speed of bond adapter motion down
TO 1.26 Controls speed of bond adapter motion up
T 1.27 Chuck supporting moveable fingers (for ISA only)
T 1.28 Controls purge flow for chamber purge negative resist
T 1.28.1 Controls purge pressure for chamber purge negative resist
T 1.29 Controls N
2
-Purge in MH
# Medium Function