Operation of the Machine
MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06
23
1
5. Wafer Alignment
– focus on the wafer plane
Adjust the left/right microscope image with the
BOTTOM SUBSTRATE LEFT/RIGHT (216) regu
-
lator. If no motorized focus exist, use the OBJEC-
TIVE FOCUS FINE MANUAL (404) on the
microscope.
–alignment
Use the micrometer screws of the alignment
stage for STG-X-Y-T-MOVEMENT (103, 104,
105). If these doesn't exist use instead this the
ARROW-keys or joysticks. Align the wafer align
-
ment marks central symmetrical to the mask
alignment marks(see Figure 7 alignment proce
-
dure).
If mask and wafer are in contact
(CONTACT INDICATOR on),
don't align the wafer!
– alignment check
Depending on your requirements, an alignment
check could be helpful using the SEP keys (303),
ALIGN CONT/EXP key (304) or the ALIGNMENT
CHECK key (305).
6. Exposure
– EXPOSURE key
By pressing this key the wafer will move into ex-
posure position. Exposure takes place. Despite
the exposure was initiated hitting the UNLOAD
key before the light shutter has opened will con
-
tinue it's exposure without wafer exposure. After
finishing the wafer chuck moves down for unload
the exposed wafer.
Watch out for the microscope
movement!
7. Unload Mask: CHANGE MASK key
Hit the CHANGE MASK key and the mask holder will
be released. Pull the mask holder out, flip it by 180°
and store it on the tray to your left. Hit ENTER to
switch the mask vacuum off. Retract the mechanical
clamping and remove the mask.
1.3.4 Bottom Side Alignment
The wafer is aligned to the mask using the bottom
side alignment microscope (BSA). The following ex
-
ample explains the steps to align and expose with
manual mask loading, vacuum contact and WEC-
type proximity. Starting from the initial state of the
machine these steps have to be performed:
1. Adjust Parameters
– select maskloading type: F1 key
Make secure that no mask is loaded before select
mask loading type.
– select alignment microscope
Activate BSA MICROSCOPE key (LED on).
– select exposure mode: SELECT PROGRAM key
Press SELECT PROGRAM key (310). Toggle
through the menu up to exposure type "Vac" and
confirm by pressing SELECT PROGRAM key
again.
– edit parameter: EDIT PARAMETER key
Press EDIT PARAMETER key (311) to edit the pa-
rameter for exposure time, alignment gap, preVac
time, fullVac time, purge time and WEC type:
spacer. Confirm the settings by pressing EDIT PA
-
RAMETER key again.
– save all settings: EDIT PROGRAM key
This function is an optional possibility to save this
parameter set for the future. Toggle with the X-
ARROW keys to "SAVE Pgm.". Select with the Y-
ARROW keys a program number. Prior saved
programs to the same number will be overwritten
without warning. Save the settings by EDIT PRO
-
GRAM key (312). Existing programs can be load-
ed from here.
2. Load Mask
Watch out for the microscope
movement!
– start mask loading sequence: CHANGE MASK
key
You have to take out the mask holder, flip it 180°
and put it on the tray left. If a mask is loaded,
press ENTER key to toggle the mask vacuum off,
retract the mechanical mask clamp and remove
the mask.
– load mask and fix it: ENTER key
Place the mask onto the mask holder against the
stop pins. Toggle the mask vacuum on by press
-
ing the ENTER key. Activate the mechanical mask
clamp by pressing on the leaf spring.
– slide the mask holder back into the machine and
clamp it: CHANGE MASK key
Flip the mask holder 180° back and move it into
the machine. Lock the mask holder slide by
pressing CHANGE MASK key again.
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