Appendix
MA6 / MA8 - 3 Appendix - Rev.05 07-06
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N2 Nitrogen
NFH Near field holography
P Purge (nitrogen)
Pgm. Program
Pre. Vac Pre vacuum
Prox Exposure type: proximity
S Substrate (square or irregular shape)
SBSA Single bottom side alignment
Soft Exposure type: soft contact
Soft-Ct Exposure type: soft contact
STG stage
SW software
TH Theta
Tri-B Triple stack bonding
TSA Top side alignment
Typ e A A type of chuck for anodic bonding
Typ e B A type of chuck for silicon to silicon pre bonding
U:F Unload substrate by fixture
U:S Unload substrate by slide
Vac Exposure type: vacuum contact
Vac-Ct Exposure type: vacuum contact
W Round wafer
WEC Wedge error compensation
Xl, Xr X-coordinate, left/right objective
Yl, Yr Y-coordinate, left/right objective
Z position of substrate/wafer relative to mask 0 means contact
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