Dell PowerEdge R660 - Page 40

Table 35. Thermal restriction for memory
Configurati
on
No
Backplane
8 x 2.5-
inch
NVMe /
SAS/
SATA
10x 2.5-inch
SAS/SATA
10x 2.5-
inch SAS/
SATA
10 x 2.5-
inch NVMe
10 x 2.5-
inch NVMe
16 x
EDSFF
E3.S
14 x
EDSFF
E3.S
Rear
storage
No Rear
Drives
No Rear
Drives
No Rear
Drives
2 x 2.5-
inch
No Rear
Drives
2 x 2.5-
inch
2 x EDSFF
E3.S
256 GB
RDIMM
35°C
(95°F)
35°C
(95°F)
30°C (86°F)
NOTE:
30°C
(86°F) for
CPU>250
W
(CPU<=25
0W could
support
35°C
(95°F) )
30°C
(86°F)
NOTE:
30°C
(86°F)
for
CPU>2
25W
(CPU<
=225W
could
support
35°C
(95°F)
)
30°C
(86°F)
NOTE:
30°C
(86°F)
for
CPU>25
0W
(CPU<=
250W
could
support
35°C
(95°F) )
30°C
(86°F)
NOTE:
30°C
(86°F)
for
CPU>22
5W
(CPU<=
225W
could
support
35°C
(95°F) )
35°C
(95°F)
35°C
(95°F)
NOTE:
● Install all fan modules for single CPU configuration.
NOTE: Not required for 8 x 2.5-inch NVMe /SAS/SATA configuration.
● All air-cooling configurations require a CPU shroud.
● Install PCH shroud for no riser configuration.
● Install Rear drive shroud for air-cooling with 2 x 2.5-inch rear drive configuration.
● Install A2 blank on R1p riser for FH riser configuration with A2 GPU.
● Install DIMM blanks in all empty DIMM slots for STD CPU heat sink or CPU TDP >=250W.
Table 36. Thermal restriction for L4 GPU
Configurat
ion
No
Backplane
8 x 2.5-
inch
NVMe /
SAS/
SATA
10x 2.5-inch
SAS/SATA
10x 2.5-
inch
SAS/
SATA
10 x 2.5-
inch
NVMe
10 x 2.5-
inch
NVMe
10 x 2.5-
inch
NVMe
16 x
EDSFF
E3.S
14 x
EDSFF
E3.S
Rear
storage
No Rear
Drives
No Rear
Drives
No Rear
Drives
2 x 2.5-
inch
No Rear
Drives
2 x 2.5-
inch
2 x EDSFF
E3.S
2 x
EDSFF
E3.S
L4 GPU
CPU>270
W not
supported
CPU>270
W not
supported
CPU>225 W
not
supported
CPU>205
W not
supported
CPU>225
W not
supported
CPU>205
W not
supported
CPU>225
W not
supported
CPU>225
W not
supported
CPU>205
W not
supported
NOTE:
● Installation of the GPU blank is necessary for the FH riser configuration (RC3) with an LP GPU card on R1P in order to
stop the system's airflow.
● No additional thermal restriction to support in R1p+R4p (2x FHs) and R2q riser.
● For 3x LPs configuration, no additional thermal restriction to support 2x L4 GPUs in slot 1 and slot 2, and non-GPU card
in slot 3.
● For 3x LPs configuration with 3x L4 GPU cards, it requires additional CPU SKUs to support restriction.
● For No BP and 8 x 2.5 inch configurations, CPU TDP higher than 270 W are not supported with 3x L4 GPUs.
● For 10x2.5 inch and 16 x EDSFF E3.S configurations, CPU TDP higher than 225 W are not supported with 3x L4 GPUs.
40 Technical specifications