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Intel Core 2 Duo Processor User Manual

Intel Core 2 Duo Processor
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Getting Started
Document Number: 320249-001
2 Getting Started
This chapter identifies the development kit’s key components, features and
specifications. It also details basic development board setup and operation.
2.1 Overview
The development board consists of a baseboard populated with the Intel
®
Core
TM
2
Duo processor, the Intel
®
GM45 Express Chipset, other system board components and
peripheral connectors.
2.2 Development Kit Contents
The following hardware, software and documentation is included in the development
kit. Check for damage that may have occurred during shipment. Contact your sales
representative if any items are missing or damaged.
Letter to the Customer
Development Kit User’s Manual (this document)
Software CD-ROM, which includes (see the readme.txt file for a complete list of
CD-ROM contents):
Embedded system BIOS
BIOS installation utilities
Chipset drivers
Intel Embedded Graphics Drivers
Intel
®
Active Management Technology (AMT) software installation kit
Pre-assembled development system, which includes:
Silver Cascade development board
Plexiglass stand with Acrylic pad
Mounting screws and standoffs (installed)
Intel
®
Core
TM
2 Duo processor with 4 MB L2 Cache on 65nm process in the
478 pin Flip-Chip Pin Grid Array (Micro-FCPGA) package (Installed)
Processor thermal solution and CPU back plate
Intel
®
GM45 Express Chipset Graphics and Memory Controller Hub (GMCH)
GMCH (GM45) heatsink
I/O Controller Hub 9M (ICH9M)
Type 2032, 3 V lithium coin cell battery
One 512 MByte, 200 Pin, DDR3 SO-DIMM
Port 80 display card
Power Supply
80 GByte SATA Hard Disk Drive
DVD-ROM Drive
Disk Drive Power and SATA Cables
One HDMI and Display Port add-in card (codename Eaglemont)
One PCI Extension Card (codename Thimble Peak 2)
One AC to DC Power Adapter

Table of Contents

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Intel Core 2 Duo Processor Specifications

General IconGeneral
Number of Cores2
Manufacturing Process65nm or 45nm (depending on model)
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
L2 Cache2MB, 4MB, or 6MB (depending on model)
Front Side Bus1066 MHz
Thermal Design Power (TDP)35W - 65W (depending on model)
Socket TypeLGA775
Clock Speed1.6 GHz - 3.33 GHz (depending on model)
Instruction Setx86, x86-64
Virtualization TechnologyYes (depending on model)
ArchitectureIntel Core Microarchitecture

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