Intel Core 2 Duo Processor User Manual

Development Board Features
26 Development Kit User’s Manual
3.3 Development Board Key Features
Features of the development board are summarized in the following table.
Table 6. Development Board Feature Set Summary
Description Comments
Processor Intel® Core™ 2 Duo processor
T9400
479-pin Micro-FCPGA socket (Socket P) with
478-pin Micro-FCPGA package. 6MB L2 cache.
FSB 667/800/1067 MT/s support
Intel® GM45 Express Graphics and
Memory Controller Hub (GM45
GMCH)
1299-pin Micro-FCBGA Package
Chipset
ICH9M Intel® ICH9M I/O Controller Hub
Memory Two DDR3 SO-DIMM slots. Maximum 8 GB using 2 Gb technology and
stacked SO-DIMMs.
Maximum 4 GB using 2 Gb technology and non-
stacked SO-DIMMs.
Minimum capacity 256 MB using 512 Mb
technology
Supports DDR3 Frequency of 800 & 1067 MHz
Video One PCI Express (PCIe) Graphics
Slot
One dual channel LVDS Connector
One VGA Connector
One TV D-Connector supporting S-
Video, Composite video and
Component video
Spread spectrum clocking
Intel GM45 Express Chipset supports four
monitors, but only has 2 video pipes which
support two screens each.
Support for SPWG3.5. 24 bit color panel support
(based on planned SPWG 4.0)
Support for two SDVO channels via x16 PCIe
connector (through add-in cards)
Support for UDI and native HDMI (via a x16
PCIe connector, usage through Eaglemont and
native HDMI through ADD card)
PCI revision 2.3 compliant (33MHz) PCI
Three 5V PCI slots are supported
through PCI Extension card
No PCI slots on motherboard
Only one PCI gold finger on board
PCI Express* Six x1 PCIe lanes
Five x1 connectors
One x16 connector
Revision 1.0a compliant
Two sets of 2 in-line x1 PCIe slots
Intel® 82567 GbE controller LAN on
motherboard (muxed with one PCIe lane)
x2 PCIe lanes to docking via resistor stuffing
option
On-Board LAN The Intel 82567 Gigabit Ethernet
LAN
The Intel 82567 is connected to ICH9M via LCI
interface and GLCI interface.
Wireless
Communication
Wireless LAN and Bluetooth support
via Upham 4 interposer
WLAN/WiMAX combo card Echo Peak support via
Upham 4

Intel Core 2 Duo Processor Specifications

General

Number of Cores	2
Manufacturing Process	65nm or 45nm (depending on model)
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
L2 Cache	2MB, 4MB, or 6MB (depending on model)
Front Side Bus	1066 MHz
Thermal Design Power (TDP)	35W - 65W (depending on model)
Socket Type	LGA775
Clock Speed	1.6 GHz - 3.33 GHz (depending on model)
Instruction Set	x86, x86-64
Virtualization Technology	Yes (depending on model)
Architecture	Intel Core Microarchitecture