Intel Core 2 Duo Processor User Manual

Development Board Features
40 Development Kit User’s Manual
Table 13. System Power Management M-States
M States System
States
Power Wells DRAM Intel ME Clocking
M0 S0 All wells powered Powered Clock chip powered and PLL,
DLL in use
M1 S3-S5 Main well down In self refresh; ME DRAM
controller on using
Channel A
Clock Chip powered with only
the GMCH clock running and
PLL, DLL in use
M-off S3-S5 Main well down Powered off (or self
refresh)
None, Intel ME powered off
The development board also supports CLKRUN#.
3.8 Testability
The development board provides an Extended Debug Port (XDP) for testing at J1F1
and direct processor probing. The XDP interface is backwards compatible with the
older ITP interface as well. The user must use an XDP or ITP interface that is
compatible with the Intel® Core™ 2 Duo processor T9400.
Note: The XDP interface is backwards compatible with the ITP interface. However, an XDP to
ITP converter cable is necessary to use the older ITP tools. Also, in some cases a
resistor change rework is necessary to get the older ITP tools to function properly.
Please contact your Intel representative for additional details.
3.9 Power Measurement Support
Power measurement resistors are provided on the platform to measure the power of
most subsystems. All power measurement resistors have a tolerance of 1%. The value
of these power measurement resistors are 2mΩ by default. Power on a particular
subsystem is calculated using the following formula:
R
V
P
2
=
R = value of the sense resistor (typically 0.002Ω)
V = the voltage difference measured across the sense resistor.
It is recommended that the user use a high precision digital multi-meter tool such as
the Agilent 34401A digital multi-meter. Refer to
2Table 14 for a comparison of a high
precision digital multi-meter (Agilent 34401A) versus a standard precision digital
multi-meter (Fluke 79).

Intel Core 2 Duo Processor Specifications

General

Number of Cores	2
Manufacturing Process	65nm or 45nm (depending on model)
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
L2 Cache	2MB, 4MB, or 6MB (depending on model)
Front Side Bus	1066 MHz
Thermal Design Power (TDP)	35W - 65W (depending on model)
Socket Type	LGA775
Clock Speed	1.6 GHz - 3.33 GHz (depending on model)
Instruction Set	x86, x86-64
Virtualization Technology	Yes (depending on model)
Architecture	Intel Core Microarchitecture