58 Rockwell Automation Publication ICSTT-RM448M-EN-P - February 2021
Chapter 4 Before You Begin
With reference to Figure 11 - Flat Panel Mounting, three mounting units are
illustrated above.
Drill three holes per base unit to suit M5 screws.
The screws are positioned with reference to the datum Hole A, which is shown
on Figure 11
above.
• Set Dimension ‘X’ to suit number of base units:
• Min 157 mm for 1 base unit
• Min 283 mm for 2 base units
• Min 409 mm for 3 base units
• Add 126 mm for each additional base unit
Base Units Rows and Expansion Cables
AADvance T9300 I/O base units connect to the right hand side of the T9100
processor base unit (I/O Bus 1) and to the right hand side of other T9300 I/O
base units by a direct plug and socket connection. The I/O base units connect
to the left hand side of the processor base unit by using the T9310 expansion
cable (I/O Bus 2). The expansion cable also connects the right hand side of I/O
base units to the left hand side of other I/O base units to install extra rows of I/
O base units. Base units are secured in place by top and bottom clips that are
inserted into the slots on each base unit.
CAUTION: HEAT DISSIPATION AND ENCLOSURE POSITION
The maximum air temperature rating in an enclosure where standard
AADvance processor and I/O modules are installed to support
predictable reliability is 70 ºC (158 °F) for I/O modules and 60 °C (140
°F) for processor modules. System and field power consumption by
modules and termination assemblies is dissipated as heat. You
should consider the effect of heat dissipation on the design and
positioning of your enclosure; e.g. enclosures exposed to continuous
sunlight will have a higher internal temperature that could increase
the operating temperature of the modules. Modules operating at the
extremes of the temperature band for a continuous period can have
a reduced reliability.
ATTENTION: DISSIPATION THERMIQUE ET EMPLACEMENT DE L’ENCEINTE
La température ambiante nominale maximum dans une enceinte où un
processeur AADvance et des modules d’E/S standard sont installés pour
assurer une fiabilité prévisible, est de 70 ºC (158 °F) pour modules d’E/S
et de 60 °C (140 °F) pour processeur. La consommation électrique du
système et du terrain par les modules et les ensembles de
raccordement est dissipée sous forme de chaleur. Vous devez tenir
compte de l’effet de la dissipation thermique lors de conception et de
disposition de votre enceinte, par exemple, des enceintes
continuellement exposées à la lumière solaire auront une température
interne plus élévée qui pourrait accroître la température de
fonctionnement des modules. La fiabilité des modules fonctionnant aux
limites extrêmes de la plage de température pendant une période
prolongée peut être réduite.
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