OPERATION OF THE MACHINE
MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06
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301 X, Y-ARROW keys
The function of these keys depends on the task per-
formed:
– movement of the upper microscope (TSA)
– movement of the lower microscope(BSA)
– movement of the wafer (only motorized stage)
(STG)
– selection of next/last parameter in the control soft-
ware (X-arrows)
– change of parameter values (Y-arrows)
Arrow keys marked with X are labeled with an triangle
pointing to the right/left. To move the manipulators
along the X-axis press one of this keys. Arrow keys
marked with Y are labeled with an triangle pointing
upward/downward. To move the manipulators along
the Y-axis press one of this keys. In case the manip
-
ulator reaches one/both limit positions along the X-
and/or Y-axis, the message on the monitor indicates:
"HW or SW limits active - use ARROW
keys"
to move back into regular range use the key for the
opposite direction.
302 FAST key
Activating this key (LED is ON) enables the movement
of the microscope manipulator and motorized stage
if existing into the desired direction with the fast
speed (otherwise the movement is performed with
the slow speed). The speed level can be adjusted
with function F1 - change align speed (see explana
-
tions to key F1).
303 SEP keys
The keys are labeled with an arrow pointing upward
and downward and marked with SEP (separation).
With these keys the alignment position of the wafer
can be changed in steps of 1 µm along the z-axis.
The keys are active after WEC. Moving to mask con
-
tact the CONTACT indicator lights on. Further moving
the wafer up this indicator flashes.
If mask and wafer are in contact
(CONTACT INDICATOR on),
don't align the wafer!
304 ALIGN CONT/EXP key
Acts as a toggle switch. The operator can quickly
change the position of the wafer between alignment
gap and exposure position relative to the mask.
If mask and wafer are in contact
(CONTACT INDICATOR on),
don't align the wafer!
305 ALIGNMENT CHECK key
With this key one can check the alignment prior ex-
posure. Particles between mask and wafer or the
edge bead can affect the alignment of the wafer to
the mask. To test that the alignment remains stable
while moving to exposure position, all parameters of
the exposure program are triggered except the expo
-
sure itself. This key is active for the exposure pro-
grams: Vacuum Contact, Low Vacuum Contact, and
Hard Contact. For example: starting the exposure
program "Vacuum Contact" triggers the pneumatic
procedures:
Pre Vac and Full Vac:
To check the possible influence of these unexpected
factors before exposure, press the ALIGNMENT
CHECK key. Press this key again to release the wafer
back into alignment gap.
If mask and wafer are in contact
(CONTACT INDICATOR on),
don't align the wafer!
306 F1 key
If one wishes to leave the variable unchanged, simply
press the flashing F1 key.
The different functions of F1 key are:
– Microscope up/down
During loading, aligning and exposure the micro-
scope does all necessary up and down move-
ments automatically. For a better view to mask
and wafer this is manually possible by using the
F1 key.
– Change alignment speed
The user can select between slow and fast align-
ment speed by the FAST key. The speed selected
by the FAST key (fast or slow) will be displayed
here. Select the desired alignment speed for the
microscopes and motorized stage (if existing).
The Y-ARROW keys change the parameter value,
the X-ARROW keys toggle between the TSA, BSA
and STG parameter. Pressing the FAST key en
-
ables the adjustment of the other speed parame-
ter (see also 3.5.4 Changing the TSA, BSA and
stage alignment speed).
– Single step config
Define the step width for the alignment stage
movement per each depression of a arrow key.
– Centering stage
For every WEC procedure the alignment stage
move to the center position for x, y and Θ. Center
-
ing stage on (default) means, the wafer goes to
alignment gap keeping this center position. Cen
-
tering stage off means, the alignment stage move
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