Operation of the Machine
MA6 / MA8 - 1. Operation of the Machine - Rev.05 07-06
13
1
to the X-, Y- and Θ-position used during the pre-
vious alignment at time of EXPOSURE key activa-
tion. In case a prior saved program contains this
position values, it will be activated.
– Select maskloading
The two options for the loading process are:
• load manually (default)
• load by slide
For Load by slide it's possible to select between:
• without alignment of the mask (no align)
• with BSA alignment of the mask (BSA align)
Both loading procedures are described separately
(see chapters 3.3.2 First mask print mode and 3.5.8
Load mask by slide).
– Scope synchron.
Infrared light is used to look through Wafer which
are opaque for visible light. The light is locally sup
-
plied using the BSA microscope arms. The TSA
microscope is used as a transmitted light micro
-
scope. Synchronous movement of TSA and BSA
microscope is necessary. To enable this, deacti
-
vate the BSA MICROSCOPE key. Switch the IL-
LUMINATION switch (210) to BSR/IR and (if
existing) the IR switch on. Adjust the TSA-objec
-
tives by the OBJECTIVE X-SEPARATION knobs
(405) to the location of the IR-light supply. The
synchronous scope movement is only possible by
the arrow keys.
– Single BSA al.
Use this special function to align substrates which
alignment mark distance is smaller then the mini
-
mum distance of the BSA objectives. For this case
use only one objective in connection with the SET
REFERENCE key and SCAN key. For detailed in
-
structions read chapter 3.3.5.
– WEC-delay
A large wafer needs longer time to set itself exact-
ly parallel to the mask. This is necessary to get
high quality mask prints of small structures over
the whole wafer. The necessary time must be
tested and set by the operator.
307 LOAD key
After the machine has been powered on, the LED of
the LOAD key is flashing. Hit the LOAD key to finalize
the boot procedure.
Press the LOAD key to start the wafer loading proce-
dure.
308 UNLOAD key
If one wishes to unload the wafer, press this key. This
key also terminates some working sequences. Press
-
ing UNLOAD after starting the exposure cycle the ex-
posure sequence will be completed without exposure
itself.
309 CHANGE MASK key
Starting from the initial screen the operator initiates
the procedure for changing (loading/unloading) of the
mask.
Unload the mask before powering off
the machine!
310 SELECT PROGRAM key
Select one of the six exposure programs of the ma-
chine (see also chapter 3.5.2).
311 EDIT PARAMETER key
After the desired exposure program has been select-
ed, press the EDIT PARAMETER key. Edit the param-
eter of the exposure program. The parameter is
changed with the corresponding Y-directional arrow
key. The next parameter is selected by the X-direc
-
tional arrow key. The number of parameters depends
on the selected exposure program (see also chapter
3.5.3).
312 EDIT PROGRAM key
This key enables the operator to assign all parameter
settings and the microscope position to a program
number ranging from [0] to [99]. This number helps to
keep all settings in the nonvolatile memory (see also
chapter 3.5.5):
–save
after exposure program selection and the param-
eter adjustment, press the EDIT PROGRAM key
and toggle to "save" using the x-ARROW keys.
Assign a program number using the y-ARROW-
keys. Press ENTER key to save it. A former saved
program to this number will be overwritten.
–load
press the EDIT PROGRAM key and toggle to
"load". Select a program number to load a former
saved program. Press ENTER key to load it.
–delete
press the EDIT PROGRAM key and toggle to "de-
lete". Select a program number to delete. Delete
the displayed program.
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