Table of Contents
About this Document.......................................................................................................15
Book Layout..........................................................................................................................................15
Intended Audience................................................................................................................................15
Publishing History................................................................................................................................15
Related Information..............................................................................................................................16
Typographic Conventions.....................................................................................................................17
HP Encourages Your Comments..........................................................................................................18
1 HP Integrity rx7640 Server and HP 9000 rp7440 Server Overview.....................19
Detailed Server Description..................................................................................................................19
Dimensions and Components.........................................................................................................20
Front Panel.......................................................................................................................................23
Front Panel Indicators and Controls..........................................................................................23
Enclosure Status LEDs...............................................................................................................23
Cell Board........................................................................................................................................24
PDH Riser Board........................................................................................................................25
Central Processor Units..............................................................................................................25
Memory Subsystem....................................................................................................................26
DIMMs........................................................................................................................................27
Cells and nPartitions........................................................................................................................27
Internal Disk Devices for the Server................................................................................................28
System Backplane............................................................................................................................29
System Bacplane to PCI-X Backplane Connectivity...................................................................29
Clocks and Reset........................................................................................................................29
I/O Subsystem..................................................................................................................................29
PCI-X/PCIe Backplane................................................................................................................32
PCI-X/PCIe Slot Boot Paths...................................................................................................33
MP/SCSI Board...........................................................................................................................34
LAN/SCSI Board........................................................................................................................34
Mass Storage (Disk) Backplane..................................................................................................34
2 Server Site Preparation................................................................................................35
Dimensions and Weights......................................................................................................................35
Electrical Specifications.........................................................................................................................36
Grounding.......................................................................................................................................36
Circuit Breaker.................................................................................................................................36
System AC Power Specifications.....................................................................................................36
Power Cords...............................................................................................................................36
System Power Specifications......................................................................................................37
Environmental Specifications...............................................................................................................38
Temperature and Humidity............................................................................................................38
Operating Environment.............................................................................................................38
Environmental Temperature Sensor..........................................................................................39
Non-Operating Environment.....................................................................................................39
Cooling.............................................................................................................................................39
Internal Chassis Cooling............................................................................................................39
Bulk Power Supply Cooling.......................................................................................................39
PCI/Mass Storage Section Cooling.............................................................................................39
Standby Cooling.........................................................................................................................39
Table of Contents 3