EasyManua.ls Logo

ElectroCraft IQ 2000 - Bonding Your System; Recommended Bonding Practices

ElectroCraft IQ 2000
120 pages
Print Icon
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
Installation 2-23
IQ 2000/5000 Installation Manual
Bonding Your System
Bonding is the practice of connecting metal chassis, assemblies, frames, shields and enclosures
to reduce the effects of electromagnetic interference (EMI).
Unless specified, most paints are not conductive, and they act as insulators. To achieve a good
bond between modules and the sub panel, surfaces need to be paint-free or plated. Bonding
metal surfaces creates a low-impedance exit path for high-frequency energy.
Figure 2.18 illustrates recommended bonding practices for painted panels, enclosures and
mounting brackets. Improper bonding blocks that direct exit path and allows high-frequency
energy to travel elsewhere in the cabinet. Excessive high-frequency energy can effect the oper-
ation of other microprocessor controlled equipment.
FIGURE 2.18 Recommended bonding practices

Table of Contents

Related product manuals