Fona XPan DG Plus - Page 4

Technical Manuals
4
2.1.6. Power supply unit ..............................................................................................................................58
2.1.7. Power switching unit JED 28 .............................................................................................................60
2.1.8. Control unit ........................................................................................................................................61
2.1.9. Multiplexer Board ...............................................................................................................................63
2.1.10. Ceph Interconnection Board ..............................................................................................................65
2.1.11. Network scheme ................................................................................................................................66
2.1.12. Modbus ..............................................................................................................................................67
2.1.13. Ethernet switch ..................................................................................................................................67
2.1.14. Detachable sensor .............................................................................................................................68
2.1.15. Tube-Housing assembly ....................................................................................................................69
2.2. SERVICE FUNCTIONS ...........................................................................................................................71
2.2.1. PAN Alignment ..................................................................................................................................71
2.2.1.1. Rotation Axis ......................................................................................................................................71
2.2.1.2. X Axis .................................................................................................................................................72
2.2.1.3. C Axis ................................................................................................................................................73
2.2.1.4. Rot. Dev. ............................................................................................................................................75
2.2.1.5. Coll. Dev. ...........................................................................................................................................76
2.2.2. Binning ...............................................................................................................................................76
2.2.3. ST Kv Filter ........................................................................................................................................77
2.2.4. Languages .........................................................................................................................................77
2.2.5. Ceph formats .....................................................................................................................................78
2.2.6. Tube head statistics ...........................................................................................................................78
2.2.7. Exposure setting ................................................................................................................................79
2.2.8. Battery change...................................................................................................................................80
2.2.9. Software info ......................................................................................................................................81
2.2.10. DAP setting ........................................................................................................................................82
2.2.11. Cam Offset .........................................................................................................................................83
2.2.12. Thermal setting ..................................................................................................................................83
2.2.12.1. Enable/Disable thermal control ..................................................................................................84
2.2.12.2. Thermal values editor.................................................................................................................84
2.2.13. Keyboard Test ...................................................................................................................................85
2.2.14. LEDS Test .........................................................................................................................................86
2.2.15. Automatic Test ...................................................................................................................................87
2.2.15.1. 100 PAN NO X-Ray ...................................................................................................................87
2.2.15.2. 10 PAN + X-ray ..........................................................................................................................87
2.2.16. X-Ray Test .........................................................................................................................................88
2.2.16.1. Continued X-Ray ........................................................................................................................88
2.2.16.2. Pulsed X-Ray .............................................................................................................................89
2.2.17. Encoders Test ....................................................................................................................................89
2.2.17.1. Rotation Axis ..............................................................................................................................89
2.2.17.2. Ceph Axis ...................................................................................................................................90
2.2.17.3. C Axis .........................................................................................................................................90
2.2.17.4. X Axis .........................................................................................................................................90
2.2.18. Voltages Test .....................................................................................................................................90
2.2.19. Ceph alignment..................................................................................................................................91
2.2.19.1. X and Rot Calib. .........................................................................................................................91
2.2.19.2. Sec. Collim. Slit ..........................................................................................................................92
2.2.19.3. CS Start Offset ...........................................................................................................................92
2.2.19.4. Ceph Axis Calib. .........................................................................................................................93
2.2.19.5. Coll. Offset .................................................................................................................................94
2.2.20. kV Mod Offset ....................................................................................................................................95
2.3. SERVICE PROCEDURES.......................................................................................................................96
2.3.1. Plastic covers .....................................................................................................................................96
2.3.2. Metal covers (Shields) .......................................................................................................................97
2.3.3. PCBs/Tube head replacement ..........................................................................................................98