Intel S2600CP Family User Manual

Appendix D: Platform Specific BMC Appendix Intel
®
Server Board S2600CP and Server System P4000CP TPS
Revision 1.1
Intel order number G26942-003
190
Chassis
Fan Domain
Major Components Cooled
(Temperature sensor number)
Fans
(Sensor number)
 Memory channels E and F(B2h)
 Memory channels G and H(B3h)
 BB P2 VR Temp(24h)
Memory VR(25h)
Hot-swap backplane 1(29h)
Hot-swap backplane 2(2Ah)
P4208XXM/
P4308XXM/
P4216XXM
(Redundant
fans,
redundant
PSUs)
0
 BMC Temp(23h)
 Memory VR(25h)
 Baseboard NIC(2Fh)
 Server South Bridge(22h)
 Hot-swap backplane 1(29h)
 Hot-swap backplane 2(2Ah)
System Fan 1 (30h)
1
 P1 Therm Margin(74h)
 P2 Therm Margin(75h)
 Memory channels C and D(B1h)
 Memory channels E and F(B2h)
 BMC Temp(23h)
 Memory VR(25h)
 Baseboard NIC(2Fh)
 Server South Bridge(22h)
 Hot-swap backplane 1(29h)
 Hot-swap backplane 2(2Ah)
System Fan 2 (31h)
2
 P1 Therm Margin(74h)
 P2 Therm Margin(75h)
 Memory channels A and B(B0h)
 Memory channels C and D(B1h)
 Memory channels E and F(B2h)
 Memory channels G and H(B3h)
 BB P2 VR Temp(24h)
 Memory VR(25h)
 Hot-swap backplane 1(29h)
 Hot-swap backplane 2(2Ah)
System Fan 3 (32h)
3
 P1 Therm Margin(74h)
 P2 Therm Margin(75h)
 Memory channels A and B(B0h)
 Memory channels C and D(B1h)
 Memory channels E and F(B2h)
 Memory channels G and H(B3h)
 BB P2 VR Temp(24h)
 Memory VR(25h)
 Hot-swap backplane 1(29h)
 Hot-swap backplane 2(2Ah)
System Fan 4 (33h)
4
 P2 Therm Margin(75h)
 Memory channels A and B(B0h)
 Memory channels G and H(B3h)
 BB P2 VR Temp(24h)
System Fan 5 (34h)

Intel S2600CP Family Specifications

General

CPU Socket Type	LGA 2011
Max CPU Count	2
Chipset	Intel C602
Memory Slots	16
Processor Support	Intel Xeon E5-2600/E5-2600 v2 series
Memory Support	DDR3
Network Interface	Gigabit Ethernet
Storage Controller	6 x SATA 3Gb/s, 2 x SATA 6Gb/s
RAID Support	RAID 0, 1, 5, 10
Form Factor	SSI EEB
USB Ports	2 USB 3.0