Intel S2600CP Family User Manual

Intel® Server Board S2600CP Functional Architecture Intel
®
Server Board S2600CP and Server System P4000CP TPS
Revision 1.1
Intel order number G26942-003
32
interconnect performance to be achieved in real systems. It has a snoop protocol optimized for
low latency and high scalability, as well as packet and lane structures enabling quick
completions of transactions. Reliability, availability, and serviceability features (RAS) are built
into the architecture.
The physical connectivity of each interconnect link is made up of twenty differential signal pairs
plus a differential forwarded clock. Each port supports a link pair consisting of two uni-directional
links to complete the connection between two components. This supports traffic in both
directions simultaneously. To facilitate flexibility and longevity, the interconnect is defined as
having five layers: Physical, Link, Routing, Transport, and Protocol.
The Intel
®
QuickPath Interconnect includes a cache coherency protocol to keep the distributed
memory and caching structures coherent during system operation. It supports both low-latency
source snooping and a scalable home snoop behavior. The coherency protocol provides for
direct cache-to-cache transfers for optimal latency.
4.2.2 Integrated Memory Controller (IMC) and Memory Subsystem
Figure 21. Memory Subsystem for Intel
®
Server Board S2600CP
Integrated into the processor is a memory controller. Each processor provides four DDR3
channels that support the following:
 Unbuffered DDR3 and registered DDR3 DIMMs
 LR DIMM (Load Reduced DIMM) for buffered memory solutions demanding higher
capacity memory subsystems
 Independent channel mode or lockstep mode
 Data burst length of eight cycles for all memory organization modes
 Memory DDR3 data transfer rates of 800, 1066, 1333, and 1600 MT/s
 64-bit wide channels plus 8-bits of ECC support for each channel
 DDR3 standard I/O Voltage of 1.5 V and DDR3 Low Voltage of 1.35 V
 1-Gb, 2-Gb, and 4-Gb DDR3 DRAM technologies supported for these devices:
o UDIMM DDR3 – SR x8 and x16 data widths, DR – x8 data width
o RDIMM DDR3 – SR,DR, and QR – x4 and x8 data widths
o LRDIMM DDR3 – QR – x4 and x8 data widths with direct map or with rank
multiplication
 Up to 8 ranks supported per memory channel, 1, 2 or 4 ranks per DIMM
 Open with adaptive idle page close timer or closed page policy
CPU 2
CPU 1
2 DIMMs/Ch
2 DIMMs/Ch

Intel S2600CP Family Specifications

General

CPU Socket Type	LGA 2011
Max CPU Count	2
Chipset	Intel C602
Memory Slots	16
Processor Support	Intel Xeon E5-2600/E5-2600 v2 series
Memory Support	DDR3
Network Interface	Gigabit Ethernet
Storage Controller	6 x SATA 3Gb/s, 2 x SATA 6Gb/s
RAID Support	RAID 0, 1, 5, 10
Form Factor	SSI EEB
USB Ports	2 USB 3.0