Operating & Maintaining the Eden 3-D Printer
7–46
DOC-00500 Rev. F
Summary Thisarea,ontherightsideofthescreen,displaysthecombinedresultsof
allthetestsrun,usingthesymbolsusedintheStatuscolumn:
Test Descriptions
and
Troubleshooting
ThefollowingtableliststhenameofeachtestintheBuilt‐inTestssuite,
togetherwithitsdescriptionandapossiblereason
foritsfailure.Ifyou
needassistance,contactyourObjectserviceprovider.
Alltestssuccessfullycompleted.
Atleastonetestfailed.
Notalltestsperformed.
Test Name Description Possible Reason for Failure
Sub‐System
Communication
Testscommunicationsbetween
Edencomponents.
Disconnectedcommunicationscable.
Faultycable.
FIFONon‐Interrupt/
FIFOInterrupt
Teststhe dataqueueintheDATA
PCIcard.
FaultyDATA_PCIcard.
Encoder Teststheencoderʹsreliabilityby
comparingreadingsfrommultiple
runsalongtheX‐axis.
Faultyencoder.
SystemInfo Comparesthefollowingparameter
valueswiththe
minimum
requirements.
• Physicalmemory
• Availablememory
• Freespaceondisk
• Monitorresolution
FailureofRAMmemoryallocationin
theEdencomputer.
BlockFilling Analyzesthethermi storreadings
whentheblockisfullandwhenitis
empty.
Faultythermistor.
Interlock Teststheinterlockintheprinter
cover.
Failureofinterlockmechanism.
Faultylatch.
Disconnectedcables.
CabinTemperature Teststhetemperaturelevelinthe
build‐trayarea.
Faulty
temperaturesensor(OHDB).
HeadEEPROM Teststheread/writecapabilitiesof
theprint‐headdrivercards.
Faultyprint‐headdrivercard.
HeadVoltage Checksthecontrolofvoltages
suppliedtotheprintheads.
Faultyprint‐headdrivercard.
TrayHeater Notusedforthisprinter —