Saia-Burgess Controls AG
Hardware manual for PCD3 series │ Document 26-789 ENG19│ 2018-06-29
Contents
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0.1 Document versions ......................................................................................... 0-4
0.2 Trademarks .................................................................................................... 0-5
1 Graphical table of contents
2 Orientation guide
2.1 Introduction ..................................................................................................... 2-2
2.2 Connection of Saia PCD
®
controllers to the internet ...................................... 2-3
2.3 ePLAN
®
macros ............................................................................................. 2-3
2.4 Planning an application .................................................................................. 2-4
2.5 E/A module cabling ......................................................................................... 2-7
2.5.1 Cable layout ................................................................................................. 2-7
2.5.2 Cable routing ............................................................................................... 2-8
2.5.3 Overvoltage protection for long distances or external cables ...................... 2-8
2.6 Series cabling ................................................................................................. 2-9
2.7 Addressing ...................................................................................................... 2-10
2.8 Labeling of the module carriers and I/O slot modules .................................... 2-12
2.8.1 Module carrier .............................................................................................. 2-12
2.8.2 I/O slot module ............................................................................................. 2-13
3 PCD3.Mxxx0 Classic CPU and module carrier
3.1 System overview ............................................................................................ 3-2
3.1.1 SBC S-Net networking concept ................................................................... 3-2
3.1.2 Saia PCD
®
Web server ............................................................................... 3-3
3.2 General technical data .................................................................................... 3-4
3.3 System resources ........................................................................................... 3-6
3.3.1 Program blocks ............................................................................................ 3-6
3.3.2 Value range of the number types ................................................................. 3-6
3.3.3 Media ........................................................................................................... 3-6
3.4 PCD3 CPU ..................................................................................................... 3-7
3.4.1 Block diagram PCD3.Mxxx0 ........................................................................ 3-7
3.4.2 PCD3.M3x20 / PCD3.M3x30 and PCD3.M5x40 / PCD3.M6x40 ................... 3-8
3.4.3 PCD3.Mxx60 ................................................................................................ 3-10
3.4.4 HardwareandrmwareversionsofthePCD3.Mxxx0 ................................. 3-12
3.5 Extension with PCD3 components ................................................................. 3-13
3.6 Module carrier ................................................................................................. 3-15
3.6.1 The module carriers (LIO) ............................................................................ 3-16
3.6.2 Calculation of the possible load ................................................................... 3-20
3.6.3 Module carrier connections .......................................................................... 3-20
3.7 Installation of the CPU and module carrier ..................................................... 3-21
3.7.1 Mounting position and ambient temperature ............................................... 3-21
3.7.2 Assembly / disassembly .............................................................................. 3-21
3.7.3 Insertion of I/O modules ............................................................................... 3-22
3.8 Dimensions ..................................................................................................... 3-23