Operation and Maintenance Manual Model 7AA Wafer Grinder
7 - 20 Version 1.2 - April 18, 1996
DYNAMIC OFFSET
The dynamic offset provides a function similar to the Spindle
Pretravel. Spindle Pretravel provides for precise calibration of
the coarse wheel position during machine initialization.
Dynamic Offset is used to provide additional calibration for the
finish wheel using the coarse wheel position as a reference.
Dynamic Offset provides compensation for two conditions: 1)
since each wheel is of different diameter mechanical deflections
may cause differences in calibration and 2) the different
grinding properties of each wheel may require compensation for
differences in grinding dynamics.
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