Operation and Maintenance Manual Model 7AA Wafer Grinder
7 - 10 Version 1.2 - April 18, 1996
GRIND WHEEL COOLANT
The coolant for each grind wheel is delivered from spouts
located above the wheel mounting plate. The coolant flows into
rings mounted on the plate to contain the coolant. Holes drilled
through the plate allow the coolant to fall onto the wafer while
grinding. Centrifugal forces from spindle rotation also direct
coolant to the inside perimeter of the grind wheel rim. This
provides high coolant flow at the wheel/wafer interface.
After prolonged use the silicon grinding particulates may build
up on the grind spindle components and eventually restrict
coolant flow by clogging the passage holes in the plate. It is
recommended that routine inspection be implemented to
maintain maximum coolant flow. Coolant flow is essential for
optimum grinding conditions.
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