Operation and Maintenance Manual Model 7AA Wafer Grinder
1 - 4 U Version 1.2 - April 18, 1996; Update 11/6/96
ABOUT THE MODEL 7AA
WAFER GRINDER
The Model 7AA Wafer Grinder is designed specifically for mechanical
grinding to remove material from the backside (the side opposite the
electronics) of semiconductor wafers to a desired thickness. A fully
automated machine, the 7AA transports wafers from dual feed
cassettes, precision grinds each wafer to thickness, rinses and dries
each wafer, measures wafer thickness, and unloads the processed
wafers into dual receive cassettes. Managed by a two-axis, closed loop
programmable control, all operations are fully automatic.
Air bearing spindles drive the grinding wheel(s) and the wafer chuck.
Required flatness, stock removal, and surface finish combinations can
be achieved at maximum production rates with the built in option of
single or two step grinding. The single step surface grind is used for
rapid stock removal or fine finish, depending upon the grit size of the
single diamond wheel. The two step grind, with coarse and fine grit
wheels concentrically mounted, may do both rapid stock removal and
fine finishing in a single wafer handling operation. The 7AA’s anti-
deflection construction features a heavy duty cast iron column and head
rigidly secured to a steel weldment base which runs the length of the
machine. Head adjustment provides simple alignment between wheel
and work spindle, assuring flatness.
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