Operation and Maintenance Manual Model 7AA Wafer Grinder
4 - 22 Version 1.2 - April 18, 1996
STEP 4 - GRIND MODE SELECTION
The grind mode select menu is used to select a single or dual
grind cycle. After all grind parameters are valid the auto cycle
can be initiated by selecting one of the two grind cycles.
To display the machine operation menu, press the "Reset" key.
Turn the key switch to "Auto" and press the "4" key. This will
display the grind mode select menu. This menu lists two
options; 1) single grind mode and 2) dual grind mode. push the
key corresponding to the desired mode. The CRT will display
the current grind parameters for that mode as programmed by
the operator. The top of the screen is reserved for displaying
any error conditions.
The display lists rapid feed rate, rapid feed thickness, finish
feed rate and finish grind thickness on the first line. The feed
wafer thickness and dwell time are displayed below. The
measured wafer thickness for the last wafer is displayed in
brackets in the lower right corner of the screen. Axis
coordinates are displayed along the bottom of the screen.
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