Operation and Maintenance Manual Model 7AA Wafer Grinder
7 - 6 Version 1.2 - April 18, 1996
GRIND OPERATION
PROCEDURES
There are many adjustment, calibration and compensation
procedures that play an important role in maintaining optimal
performance of the wafer grinding operation. This section
provides a description of these procedures and how to
implement them for maximum results.
SPINDLE SPEED SETTINGS
The rotational speeds of the spindles while grinding is critical to
maximizing grind quality and wheel performance. Both grinding
wheels consist of diamond particles suspended in a resinoid
bond. Maximum grind spindle speed is 5000 RPM while the
motor nameplate speed is 3450 RPM. Consult the factory for
the optimum grind speeds for your wheels. Optimized grinding
speeds reduce loading of the wheel and minimize wheel
dressing frequency.
The work spindle speed is not as critical as for the grind
spindle. Maximum work spindle speed is 450 rpm. Consult the
factory for optimum work chuck speeds.
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