Operation and Maintenance Manual Model 7AA Wafer Grinder
8 - 10 Version 1.2 - April 18, 1996
CONTROL VARIABLES AND
CONTACTS
There are several variables and contacts residing in the control
software which are used as troubleshooting aids or calibration
variables and may require modification for machine maintenance.
These items are listed below for reference:
(#) indicates variable has different value for various software
versions. Check the complete list before entering value.
Label Typ. Value Function
6050 OFF faster RTD update for troubleshooting
9255 OFF special elevator logic for send elevator
adjustment
520 OFF activate alarm with exhaust switch
521 OFF abort grind cycle with exhaust switch
522 OFF 25 slot cassette
530 ON elevator logic
536 OFF allows P&P#2 to make only one
attempt at retrieving wafer from
workchuck
540 ON high pressure rinse
V125 225000 max. auto feedrate axis 1
# V225 75000 max. auto feedrate axis 2
# V230 75000 grind cycle rapid move rate
V171 0 axis 1 home position
V189 7500 axis 1 position to clear door
V414 50 error correction factor (%)
V199 450 axis 1 reference position
V350 15000 axis 2 hover height
V299 8000 axis 2 reference position
V155 100 bottom of wafer dry time before
placed on rinse/spin chuck
V181 50 work chuck scrub time before first
wafer
V182 20 work chuck scrub time between each
wafer
# V185 4000 max. test wafer thickness (axis
command units)
V186 100 wafer spin dry time during
initialization.
V192 8500 small/large wheel transition coordinate
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