Operation and Maintenance Manual Model 7AA Wafer Grinder
2 - 6 Version 1.2 - April 18, 1996
FACILITIES REQUIREMENTS
The required facility connections are listed below:
1) Electrical - 208 or 230v., 60 HZ., 1 or 3 PH, 30A
2) Clean Dry Air - 90 PSI @ 15 CFM (minimum)
(see note 1)
3) D.I. water - 30 PSI @ 3 GPM (minimum)
4) Vacuum - 22 IN HG (see note 2)
5) City Water - 100 PSI MAX; 0.25 GPM
6) Exhaust - 1000 CFM, 6" dia. outlet
7) Drain - 1 1/2" PVC pipe
NOTE 1: The pressure dew point should NOT exceed 45
o
f. Care should be taken to ensure that all air
supply lines are thoroughly purged before
connection to the spindle. Teflon tape must
NEVER be used on connections downstream of
the filter.
NOTE 2: The vacuum connection to the machine will collect
a certain amount of process water and silicon
particles through the vacuum line to the vacuum
source. An isolated vacuum pump with self
contained drain system is available from
Strasbaugh as a machine option. For use with
facility vacuum supply a wall mountable
vacuum/waste separator is also available.
Consult the factory.
To Next Page
Loading...