Operation and Maintenance Manual Model 7AA Wafer Grinder
7 - 8 Version 1.2 - April 18, 1996
WHEEL TRUING AND DRESSING
Grind wheels require truing and dressing for proper operation.
Truing is required to remove any runout on the wheel surface once
the wheel is fastened to the mounting surface. Dressing prepares
the wheel for grinding by removing the surface layer of the bond
and exposing a clean diamond layer. Truing and dressing disks
are required for these operations. Both are available from the
factory.
To true or dress either wheel place the appropriate disk on the
work chuck. Select the manual jog mode. Press the [+] key for
work chuck vacuum. Verify that the disk is secure on the chuck
and on center. Manually jog the work chuck to the work chuck
position for the appropriate wheel. Jog the grind wheel to the
position where the wheel is approximately 50 microns above the
disk. Both spindles are now in position to start the chuck grind
mode. Press the [.] key to close the grind door.
To start the chuck grind mode press the [6] key. Both spindles will
begin to rotate and the coolant will flow. Press and hold the [E] key
to feed the wheel into the disk. Typical removal for truing and
dressing is 200-500 microns. After feeding the desired amount
release the [E] key and allow the wheel to dwell 10-30 seconds.
Once the truing/dressing operation is complete press the [5] key to
stop the spindles and coolant. Jog the grind spindle to its upper
limit and raise the grind door. Jog the work chuck home and
press the [R] key. The disk can now be removed from the work
chuck. It may be desirable to backflush the chuck several times
to wash away any residual abrasive from the disk grinding.
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