Operation and Maintenance Manual Model 7AA Wafer Grinder
4 - 16 Version 1.2 - April 18, 1996
The display will read:
initializing work chuck axis
The work chuck will begin moving toward its home position (out).
At the same time the grind spindle will raise to its upper limit. The
send elevator will move down to locate the test wafer then
transport the wafer to the pick-up station. Once the work chuck
has completed its home routine the pick and place will place the
wafer on the work chuck.
With the test wafer in place the work chuck will move to the work
chuck position for the coarse wheel. At this point the message:
initializing grind spindle axis
will be flashing. The grind spindle will lower until the coarse wheel
contacts the surface of the test wafer. Once the electronics have
"learned" the location of the coarse wheel the spindle will raise
back up to its upper limit. The work chuck will then move to the
work chuck position for the finish wheel and repeat the same
procedure. When both wheels have been referenced the display
will stop flashing and the work chuck will return to the home
position. The pick and place assembly will then move the wafer to
the measure station. The machine will measure the test wafer in
order to determine the actual location of each wheel when it
contacted the test wafer.
After measuring the wafer the receive conveyor will load it into the
receive cassette. The message:
initialize complete-press [r] for menu
will be displayed.
Once the start key has been pressed to begin the machine
initialization cycle the cycle cannot be interrupted until the test
wafer has been measured. If the cycle is not completed an axis
reference error condition will inhibit an auto cycle until the machine
has been initialized correctly.
OPERATING THIS MACHINE WITHOUT CORRECT
INITIALIZATION IS DANGEROUS AND COULD CAUSE
SERIOUS DAMAGE.
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