Operation and Maintenance Manual Model 7AA Wafer Grinder
5 - 4 Version 1.2 - April 18, 1996
3) Finish wear correction - enter the thickness in microns to
compensate for finish wheel wear. This parameter is
analogous to item 1 above but applied to the finish grind
cycle.
4) Finish wear limit - enter the accumulated thickness in
microns to prompt finish wheel wear correction by the
computer. This parameter is analogous to item 2 above
but applied to the finish grind cycle.
5) Test wafer thickness - this parameter displays the
measured thickness of the last test wafer used for
machine initialization.
6) Spindle pre-travel - enter the thickness in microns to
compensate for mechanical error affecting calibration.
This thickness accounts for the difference between true
grinding wheel height under static (calibration) and
dynamic (grinding) conditions. This correction will
provide more accurate finish thicknesses and is best
determined by trial and error testing. To determine the
pre-travel thickness, perform a single finish grind cycle.
The error between actual thickness and desired
thickness is the pre-travel thickness.
7) Dynamic offset - enter the thickness in microns to
compensate for differences in dynamics of coarse and
finish grinding wheels. This thickness should be set to
eliminate any thickness error from a dual grind cycle
after spindle pre-travel has been adjusted.
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