Moeller MV4 Series - Page 151

Communications Card Description ZB4-606-IF1, DeviceNet 6-2
Moeller 07/01 AWB-C2700-1347GB
CONTENTS
1 Introduction........................................................................................................................................... 6-3
2 Connection ........................................................................................................................................... 6-4
3 Control display LEDs............................................................................................................................ 6-5
4 Configuration ........................................................................................................................................ 6-5
5 Cable and wiring design ....................................................................................................................... 6-6
5.1 Cable lengths................................................................................................................................... 6-6
5.2 Line termination............................................................................................................................... 6-6
5.3 Shielding / Potential equalization.................................................................................................... 6-7
5.4 Communication cable considerations (EMC).................................................................................. 6-7
5.4.1 Manufacturing a shielded connection........................................................................................6-8
6 Application Layer .................................................................................................................................. 6-9
6.1 General description ......................................................................................................................... 6-9
6.2 Prerequisites ................................................................................................................................... 6-9
6.3 Assembly objects ............................................................................................................................ 6-9
6.4 Commissioning................................................................................................................................ 6-9
7 HMI profile description........................................................................................................................ 6-10
8 Appendix............................................................................................................................................. 6-11
8.1 EDS File Version 1.0 ..................................................................................................................... 6-11
9 Notes .................................................................................................................................................. 6-12