Strasbaugh Operator Functions
Version 1.2 - April 18, 1996 4 - 3
OPERATOR FUNCTIONS
MACHINE OPERATION
DESCRIPTION
OVERVIEW - MACHINE CYCLE
SEQUENCE WITH WAFER TRANSPORT
SYSTEM
The basic machine cycle consists of the following sequence of
events:
1) Send wafer - the send wafer transport system locates the first
available wafer in either of two send wafer cassettes and
transports it to the wafer pick-up station where it is positioned
and held for pick-up by the pick and place assembly.
2) Pick and place (pick-up station to work chuck) - the pick and
place assembly positions the #1 vacuum chuck at the pick-up
station, picks up the wafer, and sets it in place on the work
chuck.
3) Wafer grind - the work chuck draws vacuum to hold the wafer
and moves into position to perform the programmed grind
cycle. It then returns to its home position and continues
spinning while the wafer is rinsed with D.I. water. The work
chuck is backflushed and rinsed following removal of the
ground wafer.
4) Pick and place (work chuck to rinse/spin station) the pick and
place positions the #2 vacuum chuck to lift the wafer from the
work chuck and deposit it on the rinse/spin chuck.
5) Rinse/spin - after the wafer is placed on the rinse/spin chuck,
the chuck is lowered into its protective enclosure. The wafer is
rotated and rinsed with water, then rotated at a higher speed to
quickly dry the ground surface of the wafer.
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