Operation and Maintenance Manual Model 7AA Wafer Grinder
4 - 4 Version 1.2 - April 18, 1996
6) Pick and place (rinse/spin station to measurement station) -
the pick and place positions the #3 vacuum chuck to lift the
wafer from the rinse/spin chuck and deposit it at the
measurement station.
7) Measurement station - the lower cylinder of the
measurement station will raise the wafer to the thickness
probe to obtain a measurement of the finished wafer.
8) Receive wafer - the wafer is then lowered onto the receive
conveyor and loaded into the next vacant slot in either of
two receive cassettes.
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