Operation and Maintenance Manual Model 7AA Wafer Grinder
4 - 18 Version 1.2 - April 18, 1996
2) Rapid feed thickness - enter the thickness (in microns) to
which the grind wheel will use the rapid feed rate. Below
this thickness the final feed rate will be used. The
computer automatically computes this number as
rapid feed thickness = final wafer thickness + 2 microns
If a different thickness is desired, enter new data
after entering final wafer thickness.
3) Rapid coarse rate - enter the feed rate for the wheel in
tenths of microns/second (e.g. for 1.0 microns/second
enter 10). This is the feed rate that will be used for stock
removal between the maximum feed wafer thickness and
the rapid feed thickness.
4) Final wafer thickness - enter the final desired thickness
for the wafer (in microns) after grinding.
5) Final feed rate - enter the final feed rate for the wheel in
tenths of microns/second (e.g. for 1.0 microns/second
enter 10). This is the feed rate that will be used for stock
removal between the rapid feed thickness and the final
wafer thickness.
6) Grind dwell time - Enter the dwell time in tenths of a
second. This is the amount of time that the wheel will
remain at the final wafer thickness before ending the
grind cycle. The computer will place one digit to the right
of the decimal point (e.g. for 5.0 seconds enter 50).
Maximum dwell time is 99.9 seconds.
7) Wafer chuck position - Enter the coordinate for the work
chuck position while grinding. the computer will place
three digits to the right of the decimal point (e.g. for
7.000 inches enter 7000). This number will usually be
set to place the center of the work chuck under the
center of the rim of the grinding wheel. This parameter
determines which wheel will be used for the single grind
cycle. The message in the upper right corner of the
display will indicate whether the position coordinate
corresponds to the large or small wheel.
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