Strasbaugh Operator Functions
Version 1.2 - April 18, 1996 4 - 19
DUAL GRIND - COARSE PARAMETERS
This menu defines the parameters for the coarse grind portion
of a dual grind cycle. The finish wheel will grind the wafer after
the coarse wheel portion of the dual grind cycle. The
parameters used for the dual grind - coarse menu are identical
to those for the single grind menu (see preceding section).
However, the wafer chuck position should always correspond to
the position for the coarse grind wheel. Also, parameter 4
defines the thickness of the wafer after the coarse wheel grind
only. The final thickness is determined by the dual grind - finish
parameters (see next section).
To enter dual grind - coarse parameter data, enter the grind
parameters menu and press the "2" key. The seven required
pieces of data are explained below:
1) Maximum feed wafer - enter the maximum thickness of
the wafers (in microns) before grinding.
2) Rapid feed thickness - enter the thickness (in microns) to
which the coarse grind wheel will use the rapid feed rate.
Below this thickness the final feed rate will be used. The
computer automatically computes this number as
rapid feed thickness = final wafer thickness + 2 microns
If a different thickness is desired, enter new data after
entering final wafer thickness.
3) Rapid coarse rate - enter the feed rate for the coarse
wheel in tenths of microns/second (e.g. for 1.0
microns/second enter 10). This is the feed rate that will
be used for stock removal between the maximum feed
wafer thickness and the rapid feed thickness.
4) Coarse wafer thickness - enter the final desired
thickness for the wafer (in microns) after coarse grinding.
This value is also used for parameter 1 of the finish grind
parameters.
5) Coarse feed rate - enter the final feed rate for the coarse
wheel in tenths of microns/second (e.g. for 1.0
microns/second enter 10). This is the feed rate that will
be used for stock removal between the rapid feed
thickness and the coarse wafer thickness.
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