Operation and Maintenance Manual Model 7AA Wafer Grinder
4 - 20 Version 1.2 - April 18, 1996
6) Coarse dwell time - enter the dwell time in tenths of a
second. This is the amount of time that the coarse wheel will
remain at the coarse wafer thickness before ending the
grind cycle. The computer will place one digit to the right of
the decimal point (e.g. for 5.0 seconds enter 50). Maximum
dwell time is 99.9 seconds.
7) Wafer chuck position - enter the coordinate for the work
chuck position while grinding. The computer will place three
digits to the right of the decimal point (e.g. for 7.000 inches
enter 7000). This number should be set to place the center
of the work chuck under the center of the rim of the coarse
grinding wheel.
DUAL GRIND-FINISH PARAMETERS
Finish grind parameters define the necessary data to perform the
finish grind cycle. The finish grind cycle will follow the coarse grind
cycle defined in option 2 above (dual grind-coarse) if grind mode 2
is selected from the grind mode select menu. To enter finish grind
parameter data, enter the grind parameters menu and press the
"3" key. The seven required pieces of data are explained below:
1) Coarse wafer thickness - this value is automatically
displayed using the coarse wafer thickness of the coarse
grind parameters.
2) Rapid fine thickness - enter the thickness (in microns) to
which the fine grind wheel will use the rapid fine rate. Below
this thickness the finish feed rate will be used. The
computer automatically computes this number as
rapid fine thickness = final wafer thickness + 2 microns
If a different thickness is desired, enter new data after
entering final wafer thickness.
3) Rapid fine rate - enter the feed rate for the fine wheel in
tenths of microns/second (e.g. for 1.0 microns/second enter
10). This is the feed rate that will be used for stock removal
between the coarse wafer thickness and the rapid fine
thickness.
4) Finish wafer thickness - enter the final desired thickness for
the wafer (in microns) after fine grinding.
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