2. Technical Description
9
IEC 61131-2
IEC 61131-3
CE, Electromagnetic Compatibility (EMC) and Low-Voltage
Directive (LVD).
Module dimensions (W x H x D)
36.00 x 114.63 x 115.30 mm
Package dimensions (W x H x D)
44.00 x 122.00 x 147.00 mm
Table 2-4. Common Features
Notes:
Tasks: Task is an object used to call POUs. A Task can be triggered by period, events or can run in
freewheeling mode. Each task can call one or more POUs.
Real Time Clock (RTC): The retention time, time that the real time clock will continue to update
the date and time after a CPU power down, is 15 days for operation at 25 ºC. At the maximum
product temperature, the retention time is reduced to 10 days.
Isolation: The term logic is used to refer to the internal circuits such as processor, memory and bus
interfaces.
Conformal coating: The covering of electronic circuits protects internal parts of the product against
moisture, dust and other harsh elements to electronic circuits.
Specific Features
Addressable input variables memory (%I)
Addressable output variables memory (%Q)
Addressable variables memory (%M)
Symbolic variables memory
Maximum amount of memory configurable as
retentive or persistent
Total redundant data memory
Addressable input variables memory (%I)
Addressable output variables memory (%Q)
Addressable variables memory (%M)
Symbolic variables memory
Source code memory (backup)
Maximum number of expansion bus
Maximum number of I/O modules on the bus
Ethernet TCP/IP local interface
Maximum number of additional Ethernet TCP/IP
interface modules
Ethernet TCP/IP interface redundancy support
To Next Page
Loading...
General