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1.4 Power Dissipation
Benchmarks used:
Passmark Burn-in Test : 100% CPU, 100% Memory, 100% Graphics 2D, 100% Graphics 3D
Intel TAT stress tool for TDP (Thermal Design Power) and SDP (Scenario Design Power)
The TDP is the maximal power dissipation for the package, this would in normal operation not be achieved, but the test can be used for profiling
thermal solutions for cooling.
The SDP describes a more typical worst case scenario power dissipation.
The measurements below were done on one module only so there may well be variation between different modules and silicon.
Operating System: Windows 7 – 64bit
Modules used for the test measurements:
QC (Quad Core)
MSC Q7-BT-45-4001I
Intel Atom E3845 Quad Core 1.91GHz, 10W TDP, 4GB DDR3L, GbE LAN, USB 3.0 Host, 6x USB 2.0, UART, ind. Temp
DC (Dual Core)
MSC Q7-BT-26-2201I
Intel Atom E3826 Dual Core 1.46GHz, 7W TDP, 2GB DDR3L, 4GB eMMC Flash, GbE LAN, USB 3.0 Host, 6x USB 2.0, UART, ind. temp.
SC (Single Core)
MSC Q7-BT-15-2042I
Intel Atom E3815 Single Core 1.46GHz, 5W TDP, 2GB DDR3L, 4GB eMMC Flash, GbE LAN, USB 3.0 Host, 6x USB 2.0, UART, ind. temp