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2 Thermal Specifications
2.1 Heatspreader Concept
The cooling solution for a Qseven
®
module is based on a heatspreader
concept.
A heatspreader is a metal plate (typically aluminium) mounted on top
of the module. The connection between this plate and the module
components is typically made using thermal interface materials such
as phase change foils, gap pads and copper or aluminium blocks. A
very good thermal conductivity is required in order to transfer the heat
from the CPU and the chipset to the heatspreader plate.
The heatspreader used by the MSC module is thermally attached
using phase change materials and milled aluminium blocks filling the
gap between CPU and chipset dies and heatspreader plate.
The heatspreader is not a heatsink! It is a defined thermal interface for
the system designer with fixed mechanical dimensions, so it should be
possible to use different module types without problem.
The main goal for the thermal design of a system is that each device
on the module is operated within its specified thermal limits. There may
be system implementations where the heatspreader temperature could
be higher. In such a case the cooling solution design should be
validated such that the thermal specifications of all the components on
the module are not violated across the system operating temperature
range even under worst case conditions.
Figure 2-1 Overall Height including Heatspreader of the Qseven
®
Module
The overall height is dependent on the MXM-II connector used on the baseboard.
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