1. Introduction
The Switch is a 1U high and 536mm deep chassis base on Broadcom Trident3 chipset.
The physical layer will consist of 48x25G SFP28, 8x100G QSFP28 ports and 2x10G SFP+
ports. The chassis will have a nominal operating temperature range of 0 to +40 Degree C.
The CPU board is for management of the switch board , the solution is Intel BroadWell-
DE, that CPU board provide these interface: x4 PCIe2.0, SGMII, MDC/MDIO, USB2.0, and
2channel I2C connect to the switch board. There are mSATA and eUSB devices in the CPU
board and memory support DDR4 with ECC sodimm.
The following are key features of the product:
Redundant and hot-swappable PS (1+1)
Rear facing for all connections
Redundant and hot swappable fans (4+1)
1U rank mountable or desktop target 515mm
48 SFP28 25G + 8 QSFP28 40G/100G + 2 10G SFP+ ports
CPU module
➢ CPU: Intel Broadwell-DE XeonD-1518
➢ DDR SDRAM: 8GB x 2 2133MHz with ECC (DDR4 SO-DIMM)
➢ SPI Flash (Boot): 16MB
➢ USB to NAND Flash memory : 8GB SLC
➢ mSATA: 32GB MLC (Reserve)
➢ m.2 SATA: 64GB MLC
USB port (5V/1A)
SyncE & 1588 support (Reserve)
Environmental goal operation:
Front to Back Air Flow (0 to +45 degree C)
Back to Front Air Flow (0 to +45 degree C)
1.1. Reference Documents
Broadcom BCM56870 Data Sheet
IDT89307 WANPLL Data Sheet
544040_Broadwell_DE_EDS_vol1_544040_rev1p0.pdf
544041_Broadwell_DE_EDS_Registers_Vol2_544041_v1_0.pdf
544042_Broadwell_DE_SoC_EDS_vol3_544042_v1_0.pdf
544043_Broadwell_DE_EDS_rev_0_75.pdf
544044_Broadwell_DE_EDS_Vol5_544044_rev0_71.pdf
BCV-R-SB_SCH_20140804.pdf
CamelBackMnt_FAB-B_NCOR2_09-09-14.pdf
1.2. Acronyms and Terminology
Some of the acronyms used in this document are listed below:
CCSR Configuration, Control, and Status Register
PCB Printed Circuit Board
PCBA Printed Circuit Board Assembly
PSU Power Supply Unit
BMC Baseboard management controller.
POR Power On Reset
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