Motherboard, 4-27
RPG Head unit, 4-26
RPG module, 4-26
s
Selftest, 5-2
Extended, 5-2
Microprocessor Board,
5-2
Output Board, 5-4
Signal boards, 5-3
Timing Board, 5-3
Shield
Hybrid modules, 4-14
Shielding
Primary section of power supply, 4-7
Specifications,
2-
1
Status Registers, 5-42
Supply Voltages
Fixed, 5-8
Floating, 5-9
T
Terms used
Disassembly
&
Reassembly, 4-2
Test Accessories, 3-2
Test Equipment list, 3-2
Testing,
3-
1
Test Records, 3-44
Tests
Amplitude, 3-25
Delay, 3-10
Delay Jitter, 3-23
Double Pulse Delay, 3-13
Jitter, 3-17
Leading Edge, 3-37, 3-39
Overshoot and Ringing, 3-42
Period, 3-5
Period Jitter, 3-17
Preshoot, 3-42
Pulse Aberration Test, 3-41
Trailing Edge, 3-38, 3-40
Transition Time, 3-36
TT, 3-36
Variable Baseline, 3-34
Width, 3-7
Width Jitter, 3-20
Thermal Protection, l-3
Timing board
Refitting, 4-13
Removing,
4-
13
Troubleshooting,
5-12
Tools
Feedthrough Termination 50
0,
lOW,
3-3
Tools needed
Disassembly
&
Reassembly, 4-2
Transition Time leading Edge, 3-38, 3-40
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