Intel® Xeon™ Phi™ 72x5 Product Family
Single processor socket P
Thermal Design Power (TDP) up to 320W with the 1U LACC thermal
solution
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
Intel® Xeon™ Phi™ x200 Product Family
Single processor socket P (3647 pins)
Thermal Design Power (TDP) up to 230W (Air Cooled Heatsink)
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
CPUs with Integrated Intel® Omni-Path Fabric supported
Six DIMM slots in total across six memory channels
Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
Memory DDR4 data transfer rates of 2400/2666 MT/s
1 DIMM per channel
Intel C610 “Wellsburg” Platform Controller Hub (PCH)
Two RJ-45 10/100/1000 Mbit Network Interface Controller (NIC) ports
connectors/headers
One TPM Header
One Intel® Omni-Path Fabric Signal Connector
One mSATA Connector
One Bridge Board Connector
One 2x7 pin header for system fan module
One Aux Front Panel Connector
Three 8 pin fan headers for third-party chassis support
One 4 pin CPU fan or liquid cooling pump support header
One PSU Control Header
One RMII header for Intel® RMM4 Lite
One internal RGB Video Header
PCIe* 3.0 (2.5, 5, 8 GT/s)
• One 2x4 pin main power connector
• One 2x2 pin aux. power connector
•
One 4 pin power connector for disk drive power
Three 40x56mm double rotor fans
One 4 pin CPU fan or liquid cooling pump support header
Integrated 2D video graphics controller
One PCIe Gen3 x16 standard riser connector
o Supports a low-profile adapter in Riser Slot 1
One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector
o Supports a x16 low-profile adapter in Riser Slot 2
o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs with
integrated Intel® Omni-Path Fabric are used
controllers and options
Integrated 10-port SATA
o 5 ports to bridge board,
o 1 port to mSATA
o 4 ports to MiniSAS HD connector
Single Port Intel® Omni-Path Fabric via x16 Gen 3 PCIe Adapter