Intel S7200AP - Installation and Removal of the 1 U LACC; Removal of the 1 U LACC Assembly; Figure 34. 1 U LACC Assembly Installed in the System; Figure 33. 1 U LACC Assembly

2.6 Installation and Removal of the 1U LACC
Intel® Server Board S7200APR and Intel® Server Compute Module HNS7200APRL product family support
the Intel® Xeon™ Phi™ processors Bootable CPUs (up to 320W TDP) in Intel® Server Chassis H2204XXLRE.
All Intel® Xeon™ Phi™ Processors x200 or 72x5 CPU SKUs at 245W or greater TDP require use of the Intel®
1U Liquid Assisted Air Cooling (LACC) solution for optimal thermal support. The Intel® Server Board
S7200APR product family Technical Product Specfication (TPS) decribes the 1U LAAC in detail. This
section of the Service Guide describes the installation and removal of the 1U LACC coolling solution.
Note: Passive Air Cooled Heatsinks are not supported on CPUs with TDPs equal to or higher than 245w
regardless of the supported CPU generation.
2.6.1 Removal of the 1U LACC Assembly
Figure 33. 1U LACC Assembly
Figure 34. 1U LACC Assembly installed in the system