Figure 142. PHM components
1 Heat sink
9 Clips to secure processor in carrier
2 Processor identification label
10 Carrier triangular mark
3 Heat sink triangular mark 11 Processor ejector handle
4 Nut and wire bail retainer 12 Processor heat spreader
5 Torx T30 nut 13 Thermal grease
6 Anti-tilt wire bail 14 Processor contacts
7 Processor carrier 15 Processor triangular mark
8 Clips to secure carrier to heat sink
Note: The heat sink, processor, and processor carrier for your system might be different from those shown
in the illustrations.
Watch the procedure. A video of the installation and removal process is available:
• YouTube:
https://www.youtube.com/playlist?list=PLYV5R7hVcs-BXei6L6c05osQVLt4w5XYx
• Youku: https://list.youku.com/albumlist/show/id_59636529
Procedure
Step 1. Prepare your sever.
a. Remove the top cover. See “Remove the top cover” on page 225.
b. Remove the air baffle. See “Remove the air baffle” on page 133.
202
ThinkSystem SR670 V2 Maintenance Manual
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