Siemens SIMATIC S7-1500 Automation System User Manual

Glossary
S7-1500 Automation System
200 System Manual, 01/2013, A5E03461182-01
Diagnostics
Monitoring functions for the detection, localization, classification, display, and further
evaluation of errors, faults, and alarms. They run automatically while the system is in
operation. This increases the availability of systems by reducing commissioning times and
downtimes.
Distributed I/O system
System with input and output modules that are configured on a distributed basis, far away
from the CPU controlling them.
Equipotential bonding
Electrical connection (potential equalization conductor) that brings the bodies of electrical
equipment and other conductive bodies to the same or almost the same potential, in order to
prevent disruptive or dangerous voltages between these bodies.
Firmware update
Upgrade of firmware for modules, e.g. after functional enhancements, to the newest firmware
version (update).
Functional ground
The functional ground is a low-impedance current path between electric circuits and ground.
It is not designed as a safety measure but instead, for example, as a measure to improve
noise immunity.
Ground
Conductive earth whose electrical potential can be set equal to zero at any point.
All interconnected, inactive parts of a piece of equipment that cannot accept any dangerous
contact voltage, even in the event of a fault.
Ground
Conductive earth whose electrical potential can be set equal to zero at any point.
All interconnected, inactive parts of a piece of equipment that cannot accept any dangerous
contact voltage, even in the event of a fault.
Grounding
Grounding means connecting an electrically conductive part to a grounding electrode by
means of a grounding system.

Siemens SIMATIC S7-1500 Automation System Specifications

General

Series	SIMATIC S7-1500
Programming	TIA Portal (Totally Integrated Automation Portal)
Protection Class	IP20
CPU	Various models available (e.g., CPU 1511-1 PN, CPU 1518-4 PN/DP)
Controller Type	Modular Controller
Programming Languages	LAD, FBD, STL, SCL, GRAPH
Communication Interfaces	PROFINET, PROFIBUS, Ethernet, OPC UA
Digital Inputs	Varies by model and expansion modules
Digital Outputs	Varies by model and expansion modules
Analog Inputs	Varies by model and expansion modules
Analog Outputs	Varies by model and expansion modules
Backplane Bus	High-speed backplane bus for fast communication between modules
Redundancy	Supported with specific models and configurations
Safety	Integrated safety functions available
Scalability	Highly scalable with modular expansion
Operating Temperature	0°C to 60°C