Operation and Maintenance Manual Model 7AA Wafer Grinder
8 - 12 Version 1.2 - April 18, 1996
The following control variables and contacts apply to software
revision 7AARV30A (11/94) and later.
Label Typ. Value Function
V232 118 dual grind coarse retract feedrate
V233 50 dual grind fine retract feedrate
V234 236 single grind retract feedrate
V176 20 dual grind coarse retract time
V177 100 dual grind fine retract time
V178 50 single grind retract time
V10 10 work chuck flush time
V11 15 work chuck blowoff time
V12 5 time delay to turn on w.c. blowoff
V198 11811 conversion factor microns ↔ fcv
(11811)
# V195 19685 conversion factor microns ↔ acu
(19685)
V151 50 delay on time for te151 - delay till
read fine current
V152 600 delay on time for te152 - delay till
read
coarse current
# V225 225000 max. autofeedrate axis 2
# V230 225000 grind cycle rapid move rate
V227 5905 chuck grind feedrate * 10
529 OFF enable relay for current
measurement.
6062 OFF active RTD in bank2
# V185 20000 maximum wafer thickness
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